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| Semiconductor Assembly Equipment & Processing Materials |
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Ultron Systems, Inc. is a privately owned corporation established in 1982, with the goal of providing quality assembly equipment and products for the Semiconductor and Electronics Industries.
We continually strive to enhance our product line and to add newly developed equipment and tape to meet the growing demands of the semiconductor industry.
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Ultron Systems offers a wide range of precision and value-oriented semiconductor assembly equipment in both manual- and fully-automatic models, as well as one of the largest selections of semiconductor adhesive plastic tape — which include everything from conventional “blue tape” to our industry leading Silicone-Free and UV tapes — for dicing and backgrinding processes.
Ultron Systems, Inc. market products worldwide, with sales representatives located in key markets throughout the USA, Europe, and Asia. We are located in Moorpark, California, which is approximately 45 miles north of Los Angeles. |
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| Model UH108 Series: (UH108, UH108-8, UH108-12) |
Ultron Systems’ Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer — including the alignment flats — within 0.005″ in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.
| FEATURES: |
| – Adjustable spring-loaded roller assembly ensures bubble-free lamination |
| – Adjustable cutting angle, depth, and diameter to control the amount of film overhang |
– Adjustable roller pressure from topside to accommodate different film requirements
and various wafer thicknesses |
| – Cuts film to edge of wafer, including flats, within 0.005″ |
| – Vacuum-securing wafer stage |
| – Wafer-centering mechanism |
| – Retractable cutting knife blade for operator safety |
| – Adjustable alignment pins accommodate any wafer size |
| – Adjustable cutter assembly for either a “contact cut” (wafers with alignment flat(s)) OR a “non-contact cut” (wafers with an alignment notch) |
| – Spring-loaded tensioner bar prevents wafer stress due to film stretch |
| – Operates with backed or non-backed film. Optional Take-up Roller Assembly available for film with backed liner. |
| OPTIONS: |
| – Protective Film Take-up Roller Assembly: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films, which automatically winds the protective layer onto a plastic core for easy handling and disposal. |
| – Static Eliminator (with or without Power Safety Interlock Switch): A static ionization bar prevents static build-up caused from either the film unwinding or from the separation of the film from the protective layer. |
| – ‘CE’ Mark |
| [Model UH108-8]: |
| – 5″ Wafer Capability |
| – 6″ Wafer Capability |
| [Model UH108-12]: |
| – 8″ & 12″ Wafer Capability |
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