Ultron Systems, Inc. is a privately owned corporation established in 1982, with the goal of providing quality assembly equipment and products for the Semiconductor and Electronics Industries.
We continually strive to enhance our product line and to add newly developed equipment and tape to meet the growing demands of the semiconductor industry.
Ultron Systems offers a wide range of precision and value-oriented semiconductor assembly equipment in both manual- and fully-automatic models, as well as one of the largest selections of semiconductor adhesive plastic tape — which include everything from conventional “blue tape” to our industry leading Silicone-Free and UV tapes — for dicing and backgrinding processes.
Ultron Systems, Inc. market products worldwide, with sales representatives located in key markets throughout the USA, Europe, and Asia. We are located in Moorpark, California, which is approximately 45 miles north of Los Angeles.
Model UH117
Ultron Systems’ Model UH117 Wafer Cleaning System provides an ideal solution for cleaning wafers after sawing or scribing. Operation is semiautomatic and fully programmable via the new touchscreen LCD panel. Microprocessor control ensures precise, flexible, uniform, and repeatable cleaning. Up to 10 programs can be stored for different processes. Each program may have up to 99 different cleaning/rinsing/drying steps with a maximum of 999 seconds per step. The unit is capable of cleaning wafers up to 8-inches in diameter or up to 6-inches in diameter mounted on a film frame or grip ring. An optional liquid additive injection feature is available to facilitate the cleaning cycles. Both hot and cool dry modes are available for faster, more efficient drying.
FEATURES:
– Semiautomatic operation, fully programmable
– Touchscreen LCD panel
– Microprocessor control, ensures precise, flexible, uniform, and repeatable cleaning
– Store 10 programs, each with up to 99 different clean/rinse/dry steps, with 999 seconds maximum per step
– Non-volatile memory for program storage
– Accommodates up to 8″ diameter wafers; and up to 6″ diameter wafers mounted on a film frame or grip ring
– Interchangeable chuck capability
– Both hot and cool dry modes available
– Standard wafer/wafer carrier chuck with vacuum hold (specify wafer/wafer carrier size)
OPTION:
– Liquid Additive Injection Capability (under program control during wash cycle)
– Standard Brush or Soft Brush
Model UH118
The Model UH118 Wafer Cleaning System provides an optimal solution for cleaning wafers after dicing or scribing. Capable of cleaning either 12″ or 8″ (film frame mounted) wafers semiautomatically, the UH118 is fully programmable via a touchscreen LCD panel, eliminating operator variables.
The system is microprocessor-controlled to ensure precise, flexible, uniform, and repeatable cleaning. Ten programs with up to 99 different cleaning/rinsing/drying steps of up to 999 seconds maximum can be stored for different processes. Further, brush speed is programmable, and an the workstage height (with built-in safety interlock) is electronically adjustable by simply entering substrate thickness.
The Model UH118 provides dual-liquid additive capability through independent channels, in addition to the separate DI water channel. For more efficient drying, the unit is equipped with a dual heater system and a new 300 rpm air knife-assisted low-spin cycle. The Model UH118 takes wafer cleaning to the next level.
FEATURES:
– Large brush accommodates 12″ (300mm) wafer or 8″ (200mm) wafer with frame
– Microprocessor control, ensures precise, flexible, uniform, and repeatable cleaning
– Wafer cleaning with DI water and up to 2 different additives
– Dual heater, hot air over the wafer surface for faster drying
– Programmable stage/chuck height adjustment
– Interchangeable chuck capability
– Programmable brush rotation speed
– Programmable wash, rinse, and dry cycles
– Store 10 programs, each with up to 99 different clean/rinse/dry steps, with 999 seconds maximum per step
– Non-volatile memory for program storage
– Spin dry (at 300 rpm)
– Standard wafer/wafer carrier chuck with vacuum hold (specify wafer/wafer carrier size)
OPTION:
– Standard Brush or Soft Brush
Model UH119
The Model UH119 Semiautomatic Wafer Cleaning System is Ultron Systems’ latest design in quality wafer cleaning operations. Designed primarily for post-dicing applications, the UH119’s non-contact cleaning ability utilizes a variable-cycle, high pressure wash for highly efficient, fast, and exceptional wafer cleaning. Operation is extremely easy, thanks to an intelligent menu designed to eliminate any operator error. Fast and efficient cleaning is optimized through microprocessor-controlled, fully-user-programmable sequences. Up to 9 programs can be stored for repeatability.
The Model UH119 is brushless, and cleans without any direct contact to the wafer by incorporating a high-pressure power wash to remove all post-dicing debris. A unique feature of the Model UH119 is the ability to modify the cleaning “offset” of the wafer by up to 5° on each axis. This allows precision cleaning of the wafer, even if it isn’t perfectly centered.Ultron Systems’ Model UH119 High-pressure Wafer Cleaning System: An unmistakeable and intelligent choice for highly flexible, efficient, uniform, and repeatable semiautomatic wafer cleaning.
FEATURES:
– Variable-cycle operation for fast, efficient, and exceptional wafer cleaning
– Non-contact, high pressure water/surfactant cleaning
– Microprocessor controlled, ensures precise, uniform, flexible, and repeatable cleaning
– Accommodates 4″, 5″, 6″, & 8″ wafers, and 6″ & 8″ film frames
– Intelligent menu eliminates user-programming error
– “Offset” feature: complete cleaning to non-centered mounted wafers
– Fully user-programmable, semiautomatic cleaning
– Store up to 9 user-defined programs, with up to 9 separate Wash/Rinse/Dry cycles (in any order) per program, and up to 999 seconds permitted for each cycle
– Programmable rotational speed for individual cycles
– Wafer drying via air/nitrogen has adjustable flow rate up to 6 l/min
