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| Semiconductor Assembly Equipment & Processing Materials |
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Ultron Systems, Inc. is a privately owned corporation established in 1982, with the goal of providing quality assembly equipment and products for the Semiconductor and Electronics Industries.
We continually strive to enhance our product line and to add newly developed equipment and tape to meet the growing demands of the semiconductor industry. |
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Ultron Systems offers a wide range of precision and value-oriented semiconductor assembly equipment in both manual- and fully-automatic models, as well as one of the largest selections of semiconductor adhesive plastic tape — which include everything from conventional “blue tape” to our industry leading Silicone-Free and UV tapes — for dicing and backgrinding processes.
Ultron Systems, Inc. market products worldwide, with sales representatives located in key markets throughout the USA, Europe, and Asia. We are located in Moorpark, California, which is approximately 45 miles north of Los Angeles. |
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| Model UH110 Series: (UH110, UH110-8) |
Ultron Systems’ Model UH110 and UH110-8 Semiautomatic Film Removers demount film from 3″ to 8″ wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer, resulting in higher yields. Both systems outperform time-consuming hand removal at a fraction of the cost of fully automatic equipment. Throughput is as high as 200 wafers/hour. The standard Model UH110 can accommodate up to 6″ wafers, while the Model UH110-8 handles 8″ wafers and smaller. Adjustments from one size wafer to another can be made in seconds by simply changing the workstage. Push-button operation assures ease of use with all operator variables eliminated.
| FEATURES: |
| – Short removal cycle for higher throughput |
| – Virtual 180° peeling angle for lower wafer stress and higher yields |
| – Heated wafer stage: ensures film removal with minimal stress to wafer |
| – Quick peeling-tape reloading |
| – Easy disposal of demounted protective film |
| – No special operator training required |
| – Compact, tabletop size |
| – Faster and lower cost than conventional chemical removal method |
| – Interchangeable wafer stage accommodates different size/type of wafers |
| – Removes film from wafers down to 8 mil thick wafer [UH110-8] |
| – [Model UH110]: Up to 6″ wafer/film frame capability (Standard wafer stage included) |
| – [Model UH110-8]: Up to 8″ wafer/film frame capability (Standard 8″ stage included) |
| OPTIONS: |
| – Additional Standard Wafer Stage [up to 6″ for UH110; up to 8″ for UH110-8] |
| – Thin Wafer Stage [up to 6″ for UH110; up to 8″ for UH110-8] |
| – Static Eliminator with Power Safety Interlock Switch [UH110-8] |
| – ‘CE’ Mark |
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